Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorYoshiki ENDO
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorYoshiki ENDO
Estimating the term…
A semiconductor device according to embodiments comprises: a first electrode; a semiconductor element provided on the first electrode; a second electrode provided on the semiconductor element, the second electrode having a lower surface facing the semiconductor element, and having an upper surface opposite to the lower surface of the second electrode; and a third electrode overlapping the second electrode in a first direction that extends from the first electrode toward the first semiconductor element, a lower surface of the third electrode being located farther from the semiconductor element than the lower surface of the second electrode in the first direction, and an upper surface of the third electrode being located closer to the semiconductor element than the upper surface of the second electrode in the first direction.
A semiconductor device comprising:
Dependencies are inferred from the claim text.