Semiconductor device, semiconductor module, and vehicle
AssigneeRohm Co., Ltd.
InventorDaiki IKEDA
Life of this patent
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Abstract
The semiconductor device is configured to reduce positional displacement of the device relative to a heat sink. The semiconductor device includes a first conductive layer, a first semiconductor element, a target member and a sealing resin. The first semiconductor element is electrically connected to the first conductive layer. The sealing resin covers the first conductive layer, the first semiconductor element and a part of the target member. The sealing resin includes a first surface facing a first direction, and a first opening open to the first surface. The target member includes a first engaging portion exposed from the first opening.
Claims20
A semiconductor device comprising:
- a first conductive layer;
- a first semiconductor element electrically connected to the first conductive layer;
- a target member;
- and
- a sealing resin covering the first conductive layer, the first semiconductor element, and a part of the target member,
- wherein the sealing resin includes a first surface facing a first direction, and a first opening open to the first surface;
- and
- the target member includes a first engaging portion exposed from the first opening.
Dependencies are inferred from the claim text.