H10W 40/228
The projecting parts being wire-shaped or pin-shaped
Official title: {the projecting parts being wire-shaped or pin-shaped}
H10W40/228 (The projecting parts being wire-shaped or pin-shaped) appears on 3,094 US grants and 4,100 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,094
- Published applications
- 4,100
- Assignees
- 998
- Inventors
- 6,796
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 9 | 0 |
| 1994 | 10 | 0 |
| 1995 | 16 | 0 |
| 1996 | 19 | 0 |
| 1997 | 27 | 0 |
| 1998 | 43 | 0 |
| 1999 | 41 | 0 |
| 2000 | 39 | 0 |
| 2001 | 55 | 16 |
| 2002 | 50 | 72 |
| 2003 | 58 | 64 |
| 2004 | 54 | 93 |
| 2005 | 58 | 89 |
| 2006 | 69 | 102 |
| 2007 | 67 | 101 |
| 2008 | 50 | 81 |
| 2009 | 65 | 87 |
| 2010 | 87 | 121 |
| 2011 | 76 | 131 |
| 2012 | 92 | 113 |
| 2013 | 95 | 124 |
| 2014 | 85 | 139 |
| 2015 | 122 | 164 |
| 2016 | 132 | 158 |
| 2017 | 138 | 143 |
| 2018 | 144 | 155 |
| 2019 | 148 | 188 |
| 2020 | 152 | 205 |
| 2021 | 176 | 252 |
| 2022 | 159 | 253 |
| 2023 | 197 | 309 |
| 2024 | 196 | 322 |
| 2025 | 229 | 334 |
| 2026 | 106 | 284 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor package structure, heat dissipation material, and manufacturing method thereof1 Oct 2026US 2026/0305341 A1Metal Industries Research & Development Centre
- U-shaped coil arrangement in a power stage module1 Oct 2026US 2026/0305364 A1Texas Instruments Incorporated
- Package with Improved Heat Dissipation Efficiency and Method for Forming the Same17 Sep 2026US 2026/0282901 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Semiconductor device having a pad array carrier package626US 5,216,278 AMotorola, Inc. · 1993
- Pad array semiconductor device with thermal conductor and process for making the same386US 5,285,352 AMotorola, Inc. · 1994
- Integrated circuit package having adhesive bead supporting planar lid above planar substrate332US 6,268,654 B1Ankor Technology, Inc. · 2001
- Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function310US 5,640,047 AMitsui High-Tec, Inc. · 1997
- Semiconductor package280US 8,921,990 B2Samsung Electronics Co., Ltd. · 2014