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US 2026/0305364 A1Published application
U-shaped coil arrangement in a power stage module
AssigneeTexas Instruments Incorporated
InventorSudhir Nagaraj
Life of this patent
Estimating the term…
Abstract
A circuit comprises a substrate and a die over the substrate. The circuit further includes first and second contacts on the substrate between an edge of the die and an edge of the substrate, the second contact being laterally spaced from the first contact. A first conductive structure extends from the first contact and a second conductive structure extends from the second contact. A conductive trace has first and second ends coupled to the first and second conductive structures respectively, and the conductive trace at least partially overlies the die.
Claims20
A circuit comprising:
- a substrate;
- a die over the substrate;
- a first contact on the substrate between an edge of the die and an edge of the substrate;
- a second contact on the substrate between the edge of the die and the edge of the substrate, wherein the second contact is laterally spaced from the first contact;
- a first conductive structure extending from the first contact;
- a second conductive structure extending from the second contact;
- and
- a conductive trace having first and second ends coupled to the first and second conductive structures respectively, wherein the conductive trace at least partially overlies the die.
5 more elements
A circuit comprising:
- a substrate;
- a first die over the substrate;
- a second die over the substrate and laterally spaced from the first die on the substrate;
- a first pair of contacts on the substrate arranged between an edge of the substrate and an edge of the first die;
- a second pair of contacts on the substrate arranged between the edge of the substrate and an edge of the second die;
- a first conductive trace coupled to the first pair of contacts and extending away from the edge of the substrate;
- and
- a second conductive trace coupled to the second pair of contacts and extending away from the edge of the substrate.
5 more elements
A system comprising:
- a first substrate;
- a first plurality of dies over the first substrate;
- a first plurality of conductive traces each having first and second terminals contacting the first substrate between an edge of the first substrate and an edge of a die of the first plurality of dies;
- a first additional conductive trace extending over the first plurality of dies;
- a second substrate;
- a second plurality of dies over the second substrate;
- a second plurality of conductive traces each having first and second terminals contacting the second substrate between an edge of the second substrate and an edge of a die of the second plurality of dies;
- a second additional conductive trace extending over the second plurality of dies;
- and
- a processor coupled to the first terminals of the first plurality of conductive traces and the first terminals of the second plurality of conductive traces.
7 more elements
Dependencies are inferred from the claim text.