Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsKyol Park, Yun-Hyeok Im
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.
Claims13
A semiconductor package, comprising:
- a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern;
- at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads;
- a mold on the circuit board, the mold fixing the IC device to the circuit board;
- and
- a surface profile modifier on a surface of the IC device and a surface of the mold, the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat, the surface profile modifier including a heat transfer pattern on the surface of the IC device and the surface of the mold, portions of the surface of the IC device and the surface of the mold being exposed through the heat transfer pattern.
A semiconductor package, comprising:
- an integrated circuit (IC) device on a circuit board, the IC device having a top surface;
- a mold on the circuit board, the mold being adjacent to the IC device, the mold having a surface, the top surface of the IC device and the surface of the mold being modified by a surface profile modifier that increases a surface area of the surface of the IC device and a surface area of surface of the mold,
- an adhesive member on the top surface of the IC device and the surface of the mold to cover the surface profile modifier, and
- a heat dissipating member on the adhesive member.
A semiconductor package, comprising:
- a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern;
- at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads;
- a mold on the circuit board, the mold fixing the IC device to the circuit board;
- a surface profile modifier on a surface of the IC device and a surface of the mold, the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat;
- an adhesive member on the surface of the IC device and the surface of the mold to cover the surface profile modifier, the surface profile modifier enlarging a contact area with the adhesive member;
- and
- a heat dissipating member on the adhesive member.
Dependencies are inferred from the claim text.