Three-dimensional device package with carrier substrate and thermal vias

A method for producing an electronic device, the method comprising:

• disposing on a substrate a die, comprising:
• a first surface having electronic components formed thereon;
• a second surface opposite the first surface;
• and
• first thermal vias (TVs) traversing through the die between the first and second surfaces, the first TVs being arranged in a first layout for dissipating heat generated by operation of the electronic components;
• bonding, to the second surface of the die, a carrier substrate to improve stiffness of the die, the carrier substrate having a first coefficient of thermal expansion (CTE) matching a second CTE of the die, a surface of at least one of the second TVs being revealed at the second outer surface of the carrier substrate by reducing a thickness of the carrier substrate, the carrier substrate comprising second TVs traversing between first and second outer surfaces of the carrier substrate, the second TVs being arranged in a second layout different from the first layout, for transferring at least some of the heat between the first and second outer surfaces;
• and
• fabricating, between the die and the carrier substrate, a heat dissipation layer, for connecting and transferring at least some of the heat between the first TVs and the second TVs.