Package with Improved Heat Dissipation Efficiency and Method for Forming the Same

A method comprising:

• attaching an integrated circuit device to a substrate;
• forming an encapsulant over the substrate and laterally around the integrated circuit device;
• depositing a seed layer over the encapsulant and the integrated circuit device;
• forming a patterned photoresist over the seed layer, the patterned photoresist having openings;
• plating a spreading layer in the openings using the seed layer;
• removing the patterned photoresist;
• forming pillars over the spreading layer;
• and
• forming nanostructures over the pillars.

A method comprising:

• encapsulating one or more integrated circuit dies with an encapsulant;
• forming a spreading layer over the one or more integrated circuit dies and the encapsulant, wherein the spreading layer includes a first island and a second island, the first island being spaced apart from the second island;
• forming a first pillar and a second pillar over the first island, wherein each of the first pillar and the second pillar has a bulk material and pores in the bulk material;
• and
• forming first nanostructures over the first pillar and forming second nanostructures over the second pillar.