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AssigneeZhuhai ACCESS Semiconductor Co., Ltd.
InventorsXianming Chen, Lei Feng, Benxia Huang, Wenshi Wang
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A package structure with a wettable side surface and a manufacturing method thereof, and a vertical package module are disclosed. The package structure includes a first dielectric layer, a chip and a circuit layer. The first dielectric layer is provided with a package cavity, side wall bonding pads are arranged on a side wall of the first dielectric layer and located outside the package cavity. The chip is packaged inside the package cavity, pins of the chip face first surface of the first dielectric layer. The circuit layer is arranged on the first surface of the first dielectric layer, and the circuit layer is directly or indirectly connected to the side wall bonding pads and the pins of the chip.
A vertical package module, comprising:
A vertical package module, comprising:
Dependencies are inferred from the claim text.