Semiconductor package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTing-Yu Yeh, Cing-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu
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Abstract
A semiconductor package includes a redistribution structure, at least one semiconductor device and a plurality of heat dissipation films. The at least one semiconductor device is mounted on the redistribution structure. The plurality of heat dissipation films are disposed on the at least one semiconductor device in a side by side manner and jointly cover an upper surface of the at least one semiconductor device. A manufacturing method of the semiconductor package is also provided.
Claims20
A semiconductor package, comprising:
- a substrate;
- an encapsulated semiconductor package over the substrate;
- and
- a plurality of heat dissipation films disposed on a same plane of the encapsulated semiconductor package in a side-by-side manner, wherein a thickness of one of the plurality of heat dissipation films is different from a thickness of other one of the plurality of heat dissipation films.
A semiconductor package, comprising:
- a substrate;
- an interposer disposed on the substrate;
- an encapsulated semiconductor device disposed on the interposer;
- and
- a plurality of first heat dissipation film and a plurality of second heat dissipation films disposed side-by-side on a same plane of the encapsulated semiconductor device, and a thickness or viscosity of one of the plurality of first heat dissipation films is different from a thickness or viscosity of one of the plurality of second dissipation films;
- and
- a cover lid disposed on the substrate and thermally coupled to the encapsulated semiconductor device through the plurality of first heat dissipation film and the plurality of second heat dissipation films.
A semiconductor package, comprising:
- a substrate;
- an encapsulated semiconductor package disposed on the substrate, and comprising a plurality of semiconductor devices and an encapsulating material encapsulating the plurality of semiconductor devices;
- and
- a plurality of first heat dissipation films disposed over a peripheral region of the encapsulated semiconductor package;
- a plurality of second heat dissipation films disposed over a central region of the encapsulated semiconductor package, wherein a thickness or viscosity of one of the plurality of first heat dissipation films is greater than a thickness or viscosity of one of the plurality of second heat dissipation films;
- and
- a cover lid disposed on the substrate and thermally coupled to the encapsulated semiconductor package through the plurality of first heat dissipation films and the plurality of second heat dissipation films.
Dependencies are inferred from the claim text.