H10W 40/28
Comprising peltier coolers
Official title: comprising Peltier coolers
H10W40/28 (Comprising peltier coolers) appears on 551 US grants and 739 published applications in this corpus.
Search patents in H10W- Granted patents
- 551
- Published applications
- 739
- Assignees
- 339
- Inventors
- 1,546
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 2 | 0 |
| 1999 | 12 | 0 |
| 2000 | 5 | 0 |
| 2001 | 14 | 1 |
| 2002 | 11 | 19 |
| 2003 | 15 | 20 |
| 2004 | 20 | 23 |
| 2005 | 11 | 24 |
| 2006 | 10 | 30 |
| 2007 | 15 | 26 |
| 2008 | 11 | 19 |
| 2009 | 10 | 27 |
| 2010 | 15 | 22 |
| 2011 | 16 | 27 |
| 2012 | 16 | 21 |
| 2013 | 18 | 33 |
| 2014 | 24 | 32 |
| 2015 | 19 | 20 |
| 2016 | 27 | 26 |
| 2017 | 24 | 24 |
| 2018 | 21 | 26 |
| 2019 | 18 | 26 |
| 2020 | 18 | 28 |
| 2021 | 15 | 37 |
| 2022 | 22 | 43 |
| 2023 | 35 | 48 |
| 2024 | 41 | 46 |
| 2025 | 35 | 57 |
| 2026 | 22 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for cooling high power devices6 Oct 2026US 12,756,154 B2Lawrence Livermore National Security, LLC
- Peltier module, assembly, and apparatus for mask inspection8 Sep 2026US 12,732,678 B2Carl Zeiss SMT GmbH
- Substrate for facilitating one or more interconnections of an opto-electrical device11 Aug 2026US 12,706,437 B2Lumentum Operations LLC
- Transistor-scale thermoelectric devices for refrigeration of integrated circuits11 Aug 2026US 12,707,971 B2Intel Corporation
- Camera having a reduced dark current photodetector4 Aug 2026US 12,701,818 B2
- Electronic component and apparatus8 Oct 2026US 2026/0314402 A1
- Multi-layer thermo-mechanical architectures for compact energy extraction systems1 Oct 2026US 2026/0305342 A1
- On-die temperature control for semiconductor die assemblies and associated systems and methods24 Sep 2026US 2026/0293525 A1Micron Technology, Inc.
- Structure with alternate polarity thermoelectric materials and method to form same10 Sep 2026US 2026/0271718 A1GLOBALFOUNDRIES U. S. Inc.
- Peltier element and semiconductor package10 Sep 2026US 2026/0271719 A1Sony Semiconductor Solutions Corporation
Most cited
By later US patents
- Method and apparatus for recovering power from semiconductor circuit using thermoelectric device205US 5,419,780 AAST Research, Inc. · 1995
- Apparatus for cooling charge coupled device imaging systems202US 5,596,228 AOEC Medical Systems, Inc. · 1997
- Package with integrated thermoelectric module for cooling of integrated circuits200US 6,094,919 AIntel Corporation · 2000
- Temperature control device and method for manufacturing the same153US 6,347,521 B1Komatsu Ltd. · 2002
- Integrated circuit cooling apparatus147US 5,457,342 A1995