US 5,596,228 A · Apparatus for cooling charge coupled device imaging systems

Abstract

Apparatus for cooling charge-coupled device (CCD) imaging systems. The apparatus comprises a thermoelectric cooler thermally coupled to the imaging system for transferring heat away from and cooling the imaging system portion of the imaging system. The thermoelectric cooler has a cold side and an opposing hot side, with the cold side thermally coupled to the imaging sensor to enable the transfer of heat from the sensor in response to a supply of power. A power supply is coupled to the cooler for supplying required power. The hot side of the cooler is thermally coupled to a heat pipe, which is composed of a heat-conducting material having a hollow portion containing a wicking material and a working fluid. A heat sink is thermally coupled to the heat pipe enabling heat dissipation. The working fluid cyclically evaporates into vapor and condenses into liquid to effect the heat transfer from the heat pipe to the heat sink.

Claims15

Dependent claims

Apparatus for cooling a charge-coupled device imaging system, containing an imaging sensor, and the like comprising

a thermoelectric cooler thermally coupled to said system for transferring heat therefrom to cool the imaging sensor to approximately an ambient temperature, said thermoelectric cooler having a cold side and an opposing hot side, said cold side being thermally coupled to said imaging sensor to thereby cool the sensor in response to a supply of power;
a power supply coupled to the cooler for supplying power thereto;
a heat pipe means thermally coupled to said hot side for transferring heat therefrom, the heat pipe means comprising a tubular heat-conducting wall circumscribing a hollow portion, and a wicking material and a working fluid disposed in the hollow, and
a heat sink thermally coupled to the heat pipe means for transferring heat therefrom, and wherein the heat sink comprises a mass of thermally conductive material disposed so that it tracks ambient temperature.

1 more element

A method of cooling a charge-coupled device imaging system and the like which controls moisture by ambient temperature tracking, comprising

(a) providing apparatus for cooling a charge-coupled device imaging system, containing an imaging sensor, and the like comprising
a thermoelectric cooler thermally coupled to said system for transferring heat therefrom to cool the imaging sensor to a reduced temperature, said thermoelectric cooler having a cold side and an opposing hot side, said cold side being thermally coupled to said imaging system to thereby cool the imaging sensor in response to a supply of power, such that the thermoelectric cooler provides ambient temperature tracking to control moisture;
a power supply coupled to the cooler for supplying power thereto;
a heat pipe thermally coupled to said hot side for transferring heat therefrom, the heat pipe comprising a tubular heat-conducting wall circumscribing a hollow portion that contains a wicking material and a working fluid;
and a heat sink thermally coupled to the heat pipe for transferring heat therefrom, and wherein the heat sink comprises a mass of thermally conductive material so positioned so that it tracks ambient temperature;
and
(b) activating the power supply to provide power to the thermoelectric cooler for cooling the imaging sensor.

4 more elements

Dependencies are inferred from the claim text.

Apparatus for cooling charge coupled device imaging systems

Life of this patent

Apparatus for cooling charge coupled device imaging systems

Life of this patent

Abstract

Claims15