Substrate for facilitating one or more interconnections of an opto-electrical device
AssigneeLumentum Operations LLC
InventorsRoberto Galeotti, Mario Bonazzoli, Flavio Dell'Orto, Nicola Rettani
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Abstract
In some implementations, an opto-electrical device includes a heatsink; a thermally conductive element disposed on a first region of a surface of the heatsink; an adaptive thickness thermally conductive pad disposed on the thermally conductive element; an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad; a thermoelectric cooler (TEC) disposed on a second region of the surface of the heatsink; an opto-electrical chip disposed on the TEC; and a substrate disposed on the IC and the opto-electrical chip, wherein the substrate is configured to electrically connect the IC and the opto-electrical chip.
Claims20
An opto-electrical device, comprising:
- a heatsink;
- a first substructure disposed on the heatsink that includes:
- a thermally conductive element,
- an adaptive thickness thermally conductive pad disposed on the thermally conductive element,
- wherein the adaptive thickness thermally conductive pad is compressible, and
- an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad;
- a second substructure disposed on the heatsink that includes:
- a thermoelectric cooler (TEC), and
- an opto-electrical chip disposed on the TEC;
- a substrate disposed on the first substructure and the second substructure,
- wherein the substrate is disposed on the IC and the opto-electrical chip, and
- wherein the substrate is configured to electrically connect the IC and the opto-electrical chip;
- and
- attachment structures directly connecting a surface of the substrate to the IC and directly connecting the surface of the substrate to the opto-electrical chip.
An opto-electrical device, comprising:
- a heatsink;
- a thermally conductive element disposed on a first region of a surface of the heatsink;
- an adaptive thickness thermally conductive pad disposed on the thermally conductive element,
- wherein the adaptive thickness thermally conductive pad is compressible;
- an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad;
- a thermoelectric cooler (TEC) disposed on a second region of the surface of the heatsink;
- an opto-electrical chip disposed on the TEC;
- a substrate disposed on the IC and the opto-electrical chip,
- wherein the substrate is configured to electrically connect the IC and the opto-electrical chip;
- and
- a plurality of attachment structures directly connecting a surface of the substrate to the IC and directly connecting the surface of the substrate to the opto-electrical chip.
An opto-electrical device, comprising:
- a heatsink;
- a thermally conductive element disposed on a first region of a surface of the heatsink;
- an adaptive thickness thermally conductive pad disposed on the thermally conductive element,
- wherein the adaptive thickness thermally conductive pad is compressible;
- an integrated circuit (IC) disposed on the adaptive thickness thermally conductive pad;
- a thermoelectric cooler (TEC) disposed on a second region of the surface of the heatsink;
- an opto-electrical chip disposed on the TEC;
- a package body component disposed on a third region of the surface of the heatsink;
- a substrate disposed on the IC and the opto-electrical chip,
- wherein the substrate is configured to electrically connect the IC and the opto-electrical chip;
- and
- a plurality of attachment structures directly connecting a surface of the substrate to the IC and directly connecting the surface of the substrate to the opto-electrical chip.
Dependencies are inferred from the claim text.