Structure with alternate polarity thermoelectric materials and method to form same
AssigneeGlobalFoundries U.S. Inc.
InventorsParnika Gupta, Bartlomiej J. Pawlak, Christian A. Witt
Life of this patent
Estimating the term…
Abstract
The disclosure provides a structure with alternate polarity thermoelectric materials and methods to form the same. A structure of the disclosure includes a bonding layer between a first die and a second die. The bonding layer includes a set of contact pads coupling a conductive area of the first die to a conductive area of the second die. A first thermoelectric material is connected to the set of contact pads. A second thermoelectric material is also connected to the set of contact pads. The first thermoelectric material and the second thermoelectric material have different conductivity types.
Claims20
A structure comprising:
- a bonding layer between a first die and a second die, wherein the bonding layer includes:
- a set of contact pads coupling a conductive area of the first die to a conductive area of the second die;
- a first thermoelectric material connected to the set of contact pads, and
- a second thermoelectric material connected to the set of contact pads, wherein the first thermoelectric material and the second thermoelectric material have different conductivity types.
A structure comprising:
- a first die having a first integrated circuit (IC) component therein;
- a second die over the first die and having a second IC component therein;
- and
- a bonding layer between the first die and the second die, wherein the bonding layer couples the first die to the second die and further includes:
- a set of contact pads coupling a conductive area of the first die to a conductive area of the second die;
- a first thermoelectric material connected to the set of contact pads, and
- a second thermoelectric material connected to the set of contact pads, wherein the first thermoelectric material and the second thermoelectric material have different conductivity types.
A method comprising:
- forming a bonding layer between a first die and a second die, wherein the bonding layer includes:
- a set of contact pads coupling a conductive area of the first die to a conductive area of the second die;
- a first thermoelectric material connected to the set of contact pads, and
- a second thermoelectric material connected to the set of contact pads, wherein the first thermoelectric material and the second thermoelectric material have different conductivity types.
Dependencies are inferred from the claim text.