Systems and methods for cooling high power devices

A thermoelectric cooling (TEC) embedded electronics system comprising:

• a thermally and electrically conductive substrate having an outer surface and an opening forming an inner surface of the substrate;
• a die configured to be supported from the outer surface of the substrate and in thermal contact with the substrate, the die forming a heat generating semiconductor component;
• an N-type TEC material element forming a continuous loop disposed within the opening of the thermally conductive substrate, and having an outer surface and an inner surface, and the outer surface of the N-type TEC material element being positioned in contact with the inner surface of the substrate;
• a heat pipe having a first portion and a second portion, the first portion configured to be disposed within the opening of the substrate and in thermal contact with the second surface of the TEC material, and the second portion configured to project outwardly from the opening and to sink heat generated by the die and transmitted through the substrate and the N-type TEC material;
• and
• a TEC cooled heat sink in contact with the second portion of the heat pipe, to sink heat from the heat pipe.

A thermoelectric cooling (TEC) embedded electronics system comprising:

• a substrate having a first surface and a second surface and constructed of a thermally and electrically conductive material;
• a die configured to be supported from the first surface of the substrate and in thermal contact with the substrate, the die forming a heat generating component;
• a TEC material element having a first surface and a second surface, and configured to be positioned at least partially against the second surface of the substrate;
• a heat pipe having a first portion and a second portion, the first portion configured to be in thermal contact with the second surface of the TEC material, and the second portion configured to sink heat generated by the die and transmitted through the substrate and the TEC material;
• and
• the TEC material element further forming a continuous loop of N-type TEC material lining the opening of the substrate.