H10W 40/25
Characterised by their materials
Official title: characterised by their materials
H10W40/25 (Characterised by their materials) appears on 7,464 US grants and 10,343 published applications in this corpus.
Search patents in H10W- Granted patents
- 7,464
- Published applications
- 10,343
- Assignees
- 1,881
- Inventors
- 15,086
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 6 | 0 |
| 1978 | 7 | 0 |
| 1979 | 5 | 0 |
| 1980 | 6 | 0 |
| 1981 | 7 | 0 |
| 1982 | 7 | 0 |
| 1983 | 6 | 0 |
| 1984 | 7 | 0 |
| 1985 | 6 | 0 |
| 1986 | 13 | 0 |
| 1987 | 17 | 0 |
| 1988 | 8 | 0 |
| 1989 | 15 | 0 |
| 1990 | 10 | 0 |
| 1991 | 33 | 0 |
| 1992 | 37 | 0 |
| 1993 | 36 | 0 |
| 1994 | 55 | 0 |
| 1995 | 36 | 0 |
| 1996 | 59 | 0 |
| 1997 | 65 | 0 |
| 1998 | 89 | 0 |
| 1999 | 73 | 0 |
| 2000 | 92 | 0 |
| 2001 | 77 | 39 |
| 2002 | 89 | 134 |
| 2003 | 103 | 160 |
| 2004 | 115 | 175 |
| 2005 | 107 | 170 |
| 2006 | 100 | 189 |
| 2007 | 111 | 221 |
| 2008 | 103 | 196 |
| 2009 | 92 | 216 |
| 2010 | 131 | 219 |
| 2011 | 132 | 182 |
| 2012 | 141 | 213 |
| 2013 | 175 | 253 |
| 2014 | 189 | 356 |
| 2015 | 279 | 388 |
| 2016 | 326 | 469 |
| 2017 | 361 | 488 |
| 2018 | 410 | 481 |
| 2019 | 483 | 600 |
| 2020 | 464 | 622 |
| 2021 | 456 | 696 |
| 2022 | 440 | 703 |
| 2023 | 455 | 802 |
| 2024 | 535 | 866 |
| 2025 | 526 | 794 |
| 2026 | 363 | 711 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Bonding layers formed of high thermal conductivity materials6 Oct 2026US 12,757,732 B2APPLIED Materials.Inc.
- Semiconductor module6 Oct 2026US 12,757,754 B2Denso Corporation
- Semiconductor package with stacked dies and thermal substrate encapsulation6 Oct 2026US 12,757,780 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electrical connector having contact elements with superelastic properties29 Sep 2026US 12,749,836 B2Amphenol Corporation
- Method to improve interconnect coefficient of thermal expansion8 Oct 2026US 2026/0314357 A1APPLIED Materials.Inc.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Semiconductor chip, chip stacked structure and semiconductor package including the same8 Oct 2026US 2026/0314405 A1Samsung Electronics Co., Ltd.
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
Most cited
By later US patents
- Apparatus for absorbing and dissipating excess heat generated by a system553US 7,593,230 B2Sensys Medical, Inc. · 2009
- Thermal transfer coating486US 7,695,808 B23M Innovative Properties Company · 2010
- Layer transfer process and functionally enhanced integrated circuits produced thereby298US 7,855,101 B2International Business Machines Corporation · 2010
- Mold compound291US 5,709,960 AMotorola, Inc. · 1998
- Printable, flexible and stretchable diamond for thermal management281US 8,470,701 B2Advanced Diamond Technologies, Inc. · 2013