H10W 40/259
Ceramics or glasses
Official title: {Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
H10W40/259 (Ceramics or glasses) appears on 512 US grants and 704 published applications in this corpus.
Search patents in H10W- Granted patents
- 512
- Published applications
- 704
- Assignees
- 313
- Inventors
- 1,663
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 2 | 0 |
| 1994 | 9 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 7 | 0 |
| 1998 | 9 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 4 |
| 2003 | 2 | 3 |
| 2004 | 9 | 4 |
| 2005 | 3 | 7 |
| 2006 | 3 | 3 |
| 2007 | 1 | 7 |
| 2008 | 4 | 7 |
| 2009 | 2 | 9 |
| 2010 | 2 | 8 |
| 2011 | 6 | 2 |
| 2012 | 2 | 10 |
| 2013 | 8 | 16 |
| 2014 | 6 | 29 |
| 2015 | 17 | 26 |
| 2016 | 24 | 32 |
| 2017 | 29 | 59 |
| 2018 | 46 | 45 |
| 2019 | 42 | 59 |
| 2020 | 38 | 49 |
| 2021 | 37 | 54 |
| 2022 | 39 | 58 |
| 2023 | 32 | 54 |
| 2024 | 41 | 50 |
| 2025 | 24 | 62 |
| 2026 | 28 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding layers formed of high thermal conductivity materials6 Oct 2026US 12,757,732 B2APPLIED Materials.Inc.
- Semiconductor package and semiconductor package assembly with edge interconnection and method of forming the same29 Sep 2026US 12,751,289 B2Etron Technology, Inc.
- Thermally conductive semiconductor packaging structure and method for preparing same25 Aug 2026US 12,721,161 B2SJ Semiconductor(Jiangyin) Corporation
- Cooling system25 Aug 2026US 12,721,167 B2TDK Electronics Co., Ltd.
- Device for thermal conduction and electrical isolation18 Aug 2026US 12,713,528 B2Nitride Global Inc.
- Integrated circuit stack8 Oct 2026US 2026/0314412 A1Etron Technology, Inc.
- Stacked back-to-back power modules and method of manufacturing17 Sep 2026US 2026/0282942 A1General Electric Company
- Multilayer heat sinks3 Sep 2026US 2026/0262489 A1University of Maine System Board of Trustees
- Photonic or electronic chips or chiplets with thermally conductive lids including wide-bandgap materials for advanced packaging27 Aug 2026US 2026/0255961 A1Samsung Electronics Co., Ltd.
- Integrated circuits with thermal management layer adjacent to bond layer for improved heat dissipation20 Aug 2026US 2026/0247965 A1Intel Corporation
Most cited
By later US patents
- Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer190US 9,530,709 B2Qorvo US, Inc. · 2016
- Carrier for electronic components93US 6,690,583 B1Telefonaktiebolaget LM Ericsson (publ) · 2004
- High power semiconductor device with integral heat sink91US 5,057,908 AIowa State University Research Foundation, Inc. · 1991
- Cooling multi-chip modules using embedded heat pipes90US 5,355,942 ASun Microsystems, Inc. · 1994
- Semiconductor device balancing thermal expansion coefficient mismatch86US 5,751,552 AMotorola, Inc. · 1998