Cooling system
AssigneeTDK Electronics Co., Ltd.
InventorsMarkus Koini, Markus Puff, Jan Ihle, Nele Reimer
Life of this patent
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Abstract
A cooling system for a semiconductor device. The system includes a first heat sink containing a ceramic material as a main component and a semiconductor device having a first contact surface. The first heat sink serves for cooling the semiconductor device and as an electrical insulator with respect to the semiconductor device. Furthermore, a first metal-containing layer is provided on at least one outer surface of the first heat sink, the first metal-containing layer having a size at least equal to the area of the first contact surface of the semiconductor device. The semiconductor device is attached to the first metal-containing layer via the contact surface by a first bonding layer formed by soldering or sintering.
Claims16
A cooling system for a semiconductor device comprising:
- a first heat sink containing a ceramic material as a main component and an outer surface, the first heat sink serving for cooling the semiconductor device and as an electrical insulator for the semiconductor device;
- a first metal-containing layer being applied to and completely covering the outer surface of the first heat sink, the first metal-containing layer having a size which equals at least to an area of a first contact surface of the semiconductor device;
- a first bonding layer formed, by soldering or sintering, to fix the semiconductor device to the first metal-containing layer via the first contact surface;
- a second bonding layer formed by soldering or sintering and applied to a second contact surface of the semiconductor device, the second bonding layer having a main surface;
- a recess defined in the outer surface and configured in such a way that the semiconductor device is arranged therein;
- and
- a further layer having an electrically insulating material and an upper surface, the further layer being applied to areas of the outer surface, uncovered by the semiconductor device, in such a way that the main surface of the second bonding layer forms a flat surface with the upper surface of the further layer.
A cooling system for a semiconductor device comprising:
- a first heat sink containing a ceramic material as a main component and an outer surface, the first heat sink serving for cooling the semiconductor device and as an electrical insulator for the semiconductor device;
- a first metal-containing layer being applied to and completely covering the outer surface of the first heat sink, the first metal-containing layer having a size which equals at least to an area of a first contact surface of the semiconductor device;
- a second metal-containing layer being applied to the first metal-containing layer and partially or completely covering the first metal-containing layer;
- a first bonding layer formed, by soldering or sintering, to fix the semiconductor device to the second metal-containing layer via the first contact surface;
- a second bonding layer formed by soldering or sintering and applied to a second contact surface of the semiconductor device, the second bonding layer having a main surface;
- a recess defined in the outer surface and configured in such a way that the semiconductor device is arranged therein, the outer surface of the first heat sink being covered by the first metal-containing layer and the second metal-containing layer;
- and
- ceramic structures each having an upper surface, the ceramic structures being applied to areas of the outer surface, uncovered by the semiconductor device, in such a way that the main surface of the second bonding layer forms a flat surface with the upper surface of each of the ceramic structures.
Dependencies are inferred from the claim text.