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US 5,355,942 AGranted
Cooling multi-chip modules using embedded heat pipes
AssigneeSun Microsystems, Inc.
InventorAlfred S. Conte
Life of this patent
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Abstract
A method and apparatus is disclosed for cooling a multi-chip module using embedded heat pipes. Semiconductor chips are disposed into the multi-chip module through cavities in the module substrate. The semiconductor chips engage heat pipes embedded within the substrate. The heat pipes conduct heat away from the semiconductor chips through a heat conductive bonding layer.
Claims6
A method for cooling semiconductor chips, comprising the steps of:
- encasing a plurality of heat pipes within a substrate for mounting the semiconductor chips, each heat pipe having a first end and a second end;
- sealing the first and second ends of each heat pipe and enclosing the first and second ends within the substrate;
- forming a cavity for each semiconductor chip through a top face of the substrate, the cavities exposing a top surface of the heat pipes;
- coupling the semiconductor chips through the cavities in the substrate such that each semiconductor chip engages the top surface of the heat pipes.
1 more element
Dependencies are inferred from the claim text.