Stacked back-to-back power modules and method of manufacturing
AssigneeGeneral Electric Company
InventorsArun Virupaksha Gowda, Md Ehsanul Haque, Neha Beniwal
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Abstract
An electronic component includes a first subassembly and a second subassembly. The first subassembly includes a first power overlay (POL) that provides electrical connections to at least one semiconductor device included in the first subassembly. The second subassembly includes a second POL that provides electrical connections to at least one semiconductor device included in the second subassembly. The second subassembly is disposed over the first subassembly with the second POL oriented toward the first POL and with electrical connections between the first and second subassemblies that form a power module.
Claims20
An electronic component comprising:
- a first subassembly that includes a first power overlay (POL) that provides electrical connections to at least one semiconductor device included in the first subassembly;
- and
- a second subassembly that includes a second POL that provides electrical connections to at least one semiconductor device included in the second subassembly;
- wherein the second subassembly is disposed over the first subassembly with the second POL oriented toward the first POL and with electrical connections between the first and second subassemblies that form a power module.
A method of manufacturing an electronic component comprising:
- fabricating a first subassembly that includes a first power overlay (POL) that provides electrical connections to at least one semiconductor device included in the first subassembly;
- fabricating a second subassembly that includes a second POL that provides electrical connections to at least one semiconductor device included in the second subassembly;
- and
- coupling the second subassembly to the first subassembly such that the second subassembly is disposed over the first subassembly with the second POL oriented toward the first POL and with electrical connections between the first and second subassemblies that form a power module.
An electronic component comprising:
- a first subassembly that includes a first power overlay (POL) that provides electrical connections to at least one semiconductor device included in the first subassembly;
- and
- a second subassembly that includes a second POL that provides electrical connections to at least one semiconductor device included in the second subassembly;
- wherein the second subassembly is disposed over the first subassembly with the second POL and the first POL oriented such that they face substantially opposite directions and with electrical connections between the first and second subassemblies that form a power module.
Dependencies are inferred from the claim text.