H10W 40/253
Semiconductors
Official title: {Semiconductors}
H10W40/253 (Semiconductors) appears on 302 US grants and 543 published applications in this corpus.
Search patents in H10W- Granted patents
- 302
- Published applications
- 543
- Assignees
- 169
- Inventors
- 926
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 4 | 2 |
| 2003 | 1 | 4 |
| 2004 | 2 | 0 |
| 2005 | 2 | 0 |
| 2006 | 1 | 2 |
| 2007 | 2 | 2 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 2 |
| 2011 | 1 | 2 |
| 2012 | 2 | 7 |
| 2013 | 2 | 6 |
| 2014 | 7 | 12 |
| 2015 | 10 | 22 |
| 2016 | 19 | 25 |
| 2017 | 23 | 34 |
| 2018 | 20 | 17 |
| 2019 | 29 | 30 |
| 2020 | 24 | 32 |
| 2021 | 23 | 27 |
| 2022 | 14 | 29 |
| 2023 | 22 | 30 |
| 2024 | 27 | 40 |
| 2025 | 25 | 74 |
| 2026 | 19 | 141 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package with stacked dies and thermal substrate encapsulation6 Oct 2026US 12,757,780 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device18 Aug 2026US 12,713,908 B2Samsung Electronics Co., Ltd.
- Structured microchannel cooling technology by utilizing a novel hard mask pattern transfer fabrication process18 Aug 2026US 12,713,914 B2The Board of Trustees of the Leland Stanford Junior University
- Microchannel structures with buried structures18 Aug 2026US 12,713,915 B2Hewlett-Packard Development Company, L. P.
- Composite body comprising silicon carbide and method for producing same11 Aug 2026US 12,703,176 B2National Institute of Advanced Industrial Science and Technology
- Semiconductor device8 Oct 2026US 2026/0314474 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electrical interconnects for packages containing photonic integrated circuits1 Oct 2026US 2026/0305479 A1Sicily Merger Sub II, Inc.
- Etching-damage-free intermetal dielectric layer with thermal dissipation feature24 Sep 2026US 2026/0293673 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Real-time power management for on-die thermal protection10 Sep 2026US 2026/0267389 A1NVIDIA Corporation
- Eight-axis six-head linkage laser engraving machine with cooling circulation structure27 Aug 2026US 2026/0249400 A1Dongguan Di Ao Cnc Equipment Co.,Ltd
Most cited
By later US patents
- Surface mount and flip chip technology for total integrated circuit isolation185US 5,757,081 ASiliconix Incorporated · 1998
- Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like165US 4,567,505 AThe Board of Trustees of the Leland Stanford Junior University · 1986
- Surface mount and flip chip technology for total integrated circuit isolation138US 5,753,529 ASiliconix Incorporated · 1998
- Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug75US 5,895,972 AIntel Corporation · 1999
- Method for making finned heat sink assemblies67US 6,886,249 B2Advanced Energy Technology Inc. · 2005