Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug
AssigneeIntel Corporation
InventorMario J. Paniccia
Life of this patent
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Abstract
An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back side surface of the semiconductor substrate. In one embodiment, the present invention includes a semiconductor device having an infrared transparent heat slug attached to the back side surface of the device. Heat is removed from the semiconductor device through an infrared transparent heat slug that is then thermally cooled by a conventional cooling technique.
Claims29
An apparatus comprising:
- a C4 mounted semiconductor device having a backside surface;
- an infrared transparent heat slug having a bottom surface and a top surface, said bottom surface being in contact with said backside surface of said semiconductor device;
- and
- a heat sink thermally coupled to said heat slug.
An apparatus for cooling a backside surface of a semiconductor device that is attached to a substrate having an element, said semiconductor device extending above said substrate at a first height, said element extending above said substrate at a second height, said second height being greater than said first height, said apparatus comprising:
- an infrared transparent heat slug of a third height having a top surface and a bottom surface, said heat slug being disposed over said backside surface of said semiconductor device such that a thermal conduction path is provided between said backside surface of said semiconductor device and said bottom surface of said heat slug, the combination of said first and third heights extending above said substrate being greater than said second height;
- and
- a heat sink thermally coupled to said heat slug.
An apparatus comprising:
- a C4 mounted semiconductor device having a backside surface;
- and
- an infrared transparent heat slug having a bottom surface and a top surface, said bottom surface being in contact with said backside surface of said semiconductor device.
Dependencies are inferred from the claim text.