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US 12,713,914 B2Granted
Structured microchannel cooling technology by utilizing a novel hard mask pattern transfer fabrication process
AssigneeThe Board of Trustees of the Leland Stanford Junior University
InventorsSougata Hazra, Mehdi Asheghi, Kenneth E. Goodson
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Abstract
Improved microchannel structures are provided using monolithic structures having deep features (≥150 um) and two or more different feature heights above the substrate. Exemplary channel structures that are enabled by this approach include step-tapered V-groove channels, channels having various kinds of lithographically define roughness, and channels having an arbitrarily defined depth along their length.
Claims12
A microchannel structure comprising:
- a monolithically microfabricated array of channel features, wherein the monolithically microfabricated array of channel features includes a silicon substrate and silicon features having two or more different vertical feature heights above the substrate;
- wherein the monolithically microfabricated array of channel features does not include any wafer-to-wafer bonds;
- wherein the two or more different vertical feature heights include at least one vertical feature height of 150 microns or more;
- wherein the monolithically microfabricated array of channel features includes at least one channel having a bottom channel surface with a nonuniform vertical height that varies along a length of the at least one channel.
1 more element
Dependencies are inferred from the claim text.