H10W 40/258
Metallic materials
Official title: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
H10W40/258 (Metallic materials) appears on 1,554 US grants and 2,278 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,554
- Published applications
- 2,278
- Assignees
- 715
- Inventors
- 4,640
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 7 | 0 |
| 1993 | 3 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 5 | 0 |
| 1999 | 8 | 0 |
| 2000 | 11 | 0 |
| 2001 | 7 | 7 |
| 2002 | 14 | 13 |
| 2003 | 14 | 13 |
| 2004 | 8 | 19 |
| 2005 | 6 | 21 |
| 2006 | 10 | 21 |
| 2007 | 13 | 37 |
| 2008 | 19 | 28 |
| 2009 | 7 | 23 |
| 2010 | 17 | 19 |
| 2011 | 15 | 25 |
| 2012 | 15 | 26 |
| 2013 | 18 | 30 |
| 2014 | 25 | 68 |
| 2015 | 65 | 86 |
| 2016 | 71 | 104 |
| 2017 | 83 | 124 |
| 2018 | 93 | 122 |
| 2019 | 126 | 173 |
| 2020 | 139 | 172 |
| 2021 | 103 | 181 |
| 2022 | 125 | 156 |
| 2023 | 116 | 199 |
| 2024 | 129 | 202 |
| 2025 | 118 | 212 |
| 2026 | 100 | 197 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Electrical connector having contact elements with superelastic properties29 Sep 2026US 12,749,836 B2Amphenol Corporation
- Embedded package structure and power supply apparatus29 Sep 2026US 12,750,955 B2Huawei Digital Power Technologies Co., Ltd.
- Die bonding structure and method of manufacturing the same29 Sep 2026US 12,751,124 B2Materials Technology Corporation
- Nitride semiconductor device with embedded metal in trench of substrate29 Sep 2026US 12,751,287 B2Rohm Co., Ltd.
- Method to improve interconnect coefficient of thermal expansion8 Oct 2026US 2026/0314357 A1APPLIED Materials.Inc.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Integrated circuit stack8 Oct 2026US 2026/0314412 A1Etron Technology, Inc.
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
- Aluminum-diamond composite, method for producing aluminum-diamond composite, and semiconductor package1 Oct 2026US 2026/0305340 A1Denka Company Limited
Most cited
By later US patents
- Thermal transfer coating486US 7,695,808 B23M Innovative Properties Company · 2010
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Electronic package with improved thermal properties247US 5,650,663 AOlin Corporation · 1997
- Ball grid array integrated circuit package with thermal conductor198US 5,583,378 AAmkor Electronics, Inc. · 1996
- Heat transfer structure for integrated circuit package195US 4,323,914 AInternational Business Machines Corporation · 1982