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US 5,650,663 AGranted
Electronic package with improved thermal properties
AssigneeOlin Corporation
InventorArvind Parthasarathi
Life of this patent
Estimating the term…
Abstract
An electronic package having improved thermal performance. In the case of a plastic package, the inner ends of the leads of the lead frame are attached to a heat slug by a high thermal conductivity material such as solder or a polymeric material. In the case of a metal package, the inner ends of the leads of the leadframe are attached to the metal base component by a high thermal conductivity material.
Claims17
An electronic package comprising:
- a. a heat spreading substrate,
- b. an electronic device attached to said heat spreading substrate,
- c. a lead frame having a plurality of leads having their inner ends wire bonded to said electronic device and their outer ends extending from said package, and
- d. a high thermal conductivity material selected from the group consisting of solders and conductive polymers connecting said inner ends of each said lead to the heat spreading substrate.
1 more element
An electronic package comprising:
- a. a metal cover component,
- b. a metal base component, said base component and said cover component defining a cavity,
- c. an electronic component attached to said base component and positioned in said cavity,
- d. a lead frame disposed between and adapted to be bonded to said cover and base components and having inner lead ends, and
- e. a high thermal conductivity material selected from the group consisting of solders and conductive polymers connecting said inner lead ends to said base component.
2 more elements
Dependencies are inferred from the claim text.