Heat transfer structure for integrated circuit package

In an integrated circuit package including:

• at least one semiconductor chip on a circuitized substrate with a cover mounted on said substrate to enclose said semiconductor chip;
• said chip and said circuitized substrate being electrically connected by beam lead connections;
• a thin formable electrically insulative film in physical contact with said chip and enclosing a thermally conductive material between said film and the underside of said cover, said thin formable electrically insulative film is a non-conductive protective film of vapor deposited parylene, said thermally conductive material enclosed between said film of vapor deposited parylene and the underside of said cover is a liquid metal and said liquid metal includes at least one selected from the group of Gallium, Indium and Mercury;
• said assembly being characterized by the provision of said protective film of vapor deposited parylene on each of said beam lead connections, whereby said chip and said beam lead connections are protected from the deleterious effects of said thermally conductive material.

An integrated circuit package, said package including:

• a substrate containing a circuit pattern and a plurality of connection pads contained on a planar surface of said substrate;
• an integrated circuit chip and a plurality of connection pads contained on a planar surface of said chip;
• connections means selectively interconnecting said pads on chip with said pads on said substrate;
• a cover enclosing said planar surface of said substrate and said chip;
• a conformal thermally conductive material positioned between said cover and said chip and an inert protective film of vapor deposited parylene in physical contact with said chip and enclosing said thermally conductive material between said vapor deposited parylene film and the underside of said cover, said conformal thermally conductive material includes at least one liquid metal selected from the group of Gallium, Indium and Mercury;
• said packaging structure being characterized by the inclusion of said inert protective film of vapor deposited parylene completely encompassing at least said chip, said connection means, and said connection pads, whereby said conformal thermally conductive material provides an efficient heat removal path from said chip to said cover and said inert protective film of vapor deposited parylene completely protects said chip, said connections means and said connection pads from the deleterious effects of said thermally conductive material.