Embedded package structure and power supply apparatus
AssigneeHuawei Digital Power Technologies Co., Ltd.
InventorsChunyan Zhao, Chao Shen, Kuanming Bao
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Abstract
This application provides an embedded package structure and a power supply apparatus. First electronic components with smaller sizes are stacked, and then arranged in a substrate frame in a two-dimensional manner with a larger-size inductor component to form an embedded package structure. This can reduce an area occupied by the entire embedded package structure, and reduce an overall size of the structure, thereby facilitating integration and miniaturization. Then, a chip is disposed on the embedded package structure, so that the chip serving as a main heat source is placed on a surface of the power supply apparatus.
Claims19
An embedded package structure, comprising:
- a substrate frame, an inductor component embedded in the substrate frame, and a plurality of stacked first electronic components embedded in the substrate frame,
- wherein the inductor component and the plurality of stacked first electronic components are embedded in different positions of the substrate frame,
- wherein a thickness of the inductor component is greater than a respective thickness of any one of the plurality of stacked first electronic components,
- wherein each electronic component of the plurality of stacked first electronic components is a respective capacitor component or a respective resistor component, and
- wherein the plurality of stacked first electronic components includes at least one capacitor component and at least one resistor component.
A power supply apparatus, comprising:
- an embedded package structure and at least one second electronic component located on the embedded package structure,
- wherein the embedded package structure comprises a substrate frame, an inductor component embedded in the substrate frame, and a plurality of stacked first electronic components embedded in the substrate frame,
- wherein the inductor component and the plurality of stacked first electronic components are embedded in different positions of the substrate frame,
- wherein a thickness of the inductor component is greater than a respective thickness of any one of the plurality of stacked first electronic components,
- wherein each electronic component of the plurality of stacked first electronic components is a respective capacitor component or a respective resistor component,
- wherein the plurality of stacked first electronic components includes at least one capacitor component and at least one resistor component, and
- wherein the at least one second electronic component comprises at least one chip.
Dependencies are inferred from the claim text.