Aluminum-diamond composite, method for producing aluminum-diamond composite, and semiconductor package

Abstract

The aluminum-diamond composite according to the present disclosure is an aluminum-diamond composite provided with a laminated structure having a composite layer including an aluminum phase and a plurality of diamond particles having different sizes from one another, and a pair of aluminum layers sandwiching the composite layer. In a cut section obtained by cutting along the laminating direction, the plurality of diamond particles include coarse particles having a surface area of 2000 μm2 or more and fine particles having a surface area of less than 2000 μm2; and in a region extending 200 μm into the composite layer from a boundary line between the pair of aluminum layers and the composite layer, an average value α of a ratio of the total surface area of the coarse particles relative to the total surface area of the plurality of diamond particles is 65-80%.

Dependencies are inferred from the claim text.