Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation

A method of manufacturing an RF package, comprising:

• providing a package substrate defining a side, wherein a semiconductor die is attached to the side, the semiconductor die has a semiconductor substrate, wherein the semiconductor substrate defines a substrate surface, and an overmold covers the side and the semiconductor die including the semiconductor substrate;
• grinding through the overmold and the semiconductor substrate to thin the semiconductor substrate such that a surface of the semiconductor die is exposed through the overmold after the grinding;
• applying a metallization paste to the exposed surface of the semiconductor die;
• curing the metallization paste to form a sintering metallization layer attached to the substrate surface of the semiconductor substrate exposed through the overmold.

A user element that includes a radio frequency (RF) package comprising:

• a package substrate having a side;
• a semiconductor die mounted to the side of the package substrate, the semiconductor die comprising a semiconductor substrate, wherein the semiconductor substrate defines a substrate surface;
• an overmold that covers the side of the package substrate, wherein the substrate surface of the semiconductor substrate is exposed through the overmold;
• and
• a sintering metallization layer attached to the substrate surface of the semiconductor substrate is exposed through the overmold.