H10W 40/254
Diamond
Official title: {Diamond}
H10W40/254 (Diamond) appears on 554 US grants and 645 published applications in this corpus.
Search patents in H10W- Granted patents
- 554
- Published applications
- 645
- Assignees
- 288
- Inventors
- 1,438
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 7 | 0 |
| 1993 | 9 | 0 |
| 1994 | 9 | 0 |
| 1995 | 8 | 0 |
| 1996 | 14 | 0 |
| 1997 | 11 | 0 |
| 1998 | 13 | 0 |
| 1999 | 12 | 0 |
| 2000 | 7 | 0 |
| 2001 | 11 | 3 |
| 2002 | 12 | 15 |
| 2003 | 14 | 12 |
| 2004 | 9 | 26 |
| 2005 | 12 | 11 |
| 2006 | 11 | 24 |
| 2007 | 11 | 21 |
| 2008 | 15 | 18 |
| 2009 | 15 | 13 |
| 2010 | 8 | 15 |
| 2011 | 11 | 14 |
| 2012 | 12 | 25 |
| 2013 | 14 | 12 |
| 2014 | 16 | 17 |
| 2015 | 14 | 15 |
| 2016 | 19 | 12 |
| 2017 | 18 | 31 |
| 2018 | 22 | 18 |
| 2019 | 29 | 36 |
| 2020 | 31 | 25 |
| 2021 | 25 | 44 |
| 2022 | 20 | 36 |
| 2023 | 19 | 47 |
| 2024 | 22 | 37 |
| 2025 | 34 | 59 |
| 2026 | 19 | 59 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor packaging15 Sep 2026US 12,740,414 B2Chung Ang University Industry Academic Cooperation Foundation
- Devices having and methods of forming thermally conductive substrates4 Aug 2026US 12,702,001 B2Akash Systems, Inc.
- Synthetic diamond plates28 Jul 2026US 12,696,761 B2Element Six Technologies Limited
- Heat conducting member, optical module, heat sink, and method for preparing heat conducting member9 Jun 2026US 12,650,564 B2Huawei Technologies Co., Ltd.
- Semiconductor device assemblies and systems with improved thermal performance and methods for making the same9 Jun 2026US 12,653,077 B2Micron Technology, Inc.
- Heterojunction bipolar transistor8 Oct 2026US 2026/0314408 A1GLOBALFOUNDRIES U. S. Inc.
- Devices and methods involving heat-dissipation via engineered interlayer adjacent diamond1 Oct 2026US 2026/0305338 A1The Board of Trustees of the Leland Stanford Junior University
- Aluminum-diamond composite, method for producing aluminum-diamond composite, and semiconductor package1 Oct 2026US 2026/0305340 A1Denka Company Limited
- Integrated circuits with fusion-bonded diamond substrates for thermal management24 Sep 2026US 2026/0293674 A1Intel Corporation
- Diamond-based thermal cooling devices methods and materials24 Sep 2026US 2026/0293675 A1
Most cited
By later US patents
- Thermal transfer coating486US 7,695,808 B23M Innovative Properties Company · 2010
- Printable, flexible and stretchable diamond for thermal management281US 8,470,701 B2Advanced Diamond Technologies, Inc. · 2013
- Semiconductor device and process for producing the same163US 4,764,804 AHitachi, Ltd. · 1988
- Embedded thermal conductors for semiconductor chips150US 5,955,781 AInternational Business Machines Corporation · 1999
- Conformal diamond coating for thermal improvement of electronic packages146US 5,907,189 ALSI Logic Corporation · 1999