Integrated circuits with fusion-bonded diamond substrates for thermal management

Abstract

Devices and systems with diamond substrates bonded to integrated circuits, and methods of forming the same, are disclosed herein. In one example, a microelectronic assembly includes a semiconductor substrate, a diamond substrate, a first dielectric layer on the semiconductor substrate, and a second dielectric layer on the diamond substrate, where the second dielectric layer is bonded to the first dielectric layer.

Dependencies are inferred from the claim text.