Conformal diamond coating for thermal improvement of electronic packages

A semiconductor package, comprising:

• a package substrate having a plurality of electrically conductive traces formed thereon, an upper surface and a lower surface, the lower surface having a plurality of contacts for providing electrical connection between the conductive traces formed on the package substrate and a plurality of conductive traces formed on a printed circuit board;
• a semiconductor die with an upper surface and a lower surface, the lower surface of the semiconductor die mounted to the upper surface of the package substrate, the semiconductor die having a plurality of bond pads formed thereon which are electrically connected to the conductive traces formed on the package substrate;
• a coating disposed on at least part of the upper surface of the package substrate and at least part of the upper surface of the semiconductor die, the coating comprising diamond;
• a heat sink for transferring heat away from the semiconductor die, the heat sink being attached to the diamond coating disposed on the upper surface of the package substrate.