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US 2026/0293675 A1Published application
Diamond-based thermal cooling devices methods and materials
AssigneeBenjamin K. Sharfi
InventorsBenjamin K. Sharfi, Saul Gonzalez, Kadek W. Hemawan
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Abstract
Disclosed are novel diamond-based devices, methods, and materials for use in thermal interface cooling, including a freestanding diamond wafer heat spreader, liquefied diamond thermal interface materials coolant and encapsulated nanocrystalline diamond metal heat spreaders.
Claims11
A heat spreader for dissipating heat from an electronic component, the heat spreader comprising:
- a diamond wafer;
- and
- the diamond wafer having a surface shape and size substantially corresponding to a surface on the electronic component.
A method for dissipating heat from an electronic component, the method consisting of:
- providing a heat spreader;
- providing a diamond wafer, the diamond wafer being a diamond wafer heat spreader and having a first side and a second side;
- the first side having a shape and size substantially corresponding to a surface on the electronic component;
- the second side having a shape and size substantially corresponding to a surface on the heat spreader;
- and
- mounting the diamond wafer between the heat spreader and the electronic component so that the first side abuts the surface of the electronic component and the second side abuts the surface of the heat spreader.
3 more elements
Dependencies are inferred from the claim text.