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US 5,709,960 AGranted
Mold compound
AssigneeMotorola, Inc.
InventorsLonne L. Mays, Mark D. Mosher, Alexandra Hubenko
Life of this patent
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Abstract
An electronic component has a body (11) that is formed from a mold compound that includes a thermoplastic material (31), a first filler (32) comprised of an electrically insulative material wherein the first filler (32) is more thermally conductive than the thermoplastic material (31), and a second filler (33) comprised of an electrically conductive material wherein the second filler (33) is more thermally conductive than the thermoplastic material (31).
Claims20
An electronic component comprising:
- a semiconductor substrate;
- a semiconductor device in the semiconductor substrate;
- a lead electrically coupled to the semiconductor device;
- and
- an encapsulant overlying the semiconductor device wherein the encapsulant is electrically insulative, the encapsulant comprising:
- a plurality of electrically conductive fibers having a first thermal conductivity;
- a plurality of electrically insulative particles having a second thermal conductivity;
- and
- a thermoplastic polymer having a third thermal conductivity, the third thermal conductivity less than the first and second thermal conductivities.
6 more elements
An electronic component comprising:
- a semiconductor device;
- and
- a mold compound covering the semiconductor device, the mold compound comprising:
- a thermoplastic material;
- a first filler comprised of an electrically insulative material wherein the first filler is more thermally conductive than the thermoplastic material;
- and
- a second filler comprised of an electrically conductive material wherein the second filler is more thermally conductive than the thermoplastic material.
4 more elements
An electronic component comprising:
- a semiconductor device;
- and
- an electrically insulative mold compound overlying at least a portion of the semiconductor device, the electrically insulative mold compound having a plurality of fillers wherein a first one of the plurality of fillers is electrically insulative and wherein a second one of the plurality of fillers is electrically conductive and wherein a weight percent of the first one of the plurality of fillers is greater than a weight percent of the second one of the plurality of fillers.
Dependencies are inferred from the claim text.