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US 2026/0314407 A1Published application
Power module with selective heat spreader
AssigneeMicrochip Technology Incorporated
InventorsShesh Mani Pandey, Fernando Estrada
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Abstract
A power module comprises a plurality of dies including a first die subset and a second die subset, with each subset including one or more of the dies. The second die subset is associated with a power module hotspot and has a higher operating temperature than the first die subset. A first encapsulation material is disposed on the first die subset. A second encapsulation material is disposed on the second die subset. The second encapsulation material has higher thermal conductivity than the first encapsulation material.
Claims20
A power module comprising:
- a plurality of dies including a first die subset and a second die subset, with each of the die subsets including one or more of the dies,
- the second die subset being associated with a power module hotspot, such that the second die subset is associated with a higher operating temperature than the first die subset;
- a first encapsulation material disposed on first die subset;
- and
- a second encapsulation material disposed on the second die subset,
- the second encapsulation material having higher thermal conductivity than the first encapsulation material.
3 more elements
A method of making a power module comprising:
- providing a substrate;
- disposing a plurality of dies on the substrate, with a second die subset being associated with a power module hotspot and having a higher operating temperature than a first die subset;
- encapsulating the first die subset with a first encapsulation material;
- and
- encapsulating the second die subset with a second encapsulation material having higher thermal conductivity than the first encapsulation material.
2 more elements
Dependencies are inferred from the claim text.