H10W 40/255
Having a laminate or multilayered structure
Official title: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
H10W40/255 (Having a laminate or multilayered structure) appears on 3,419 US grants and 4,862 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,419
- Published applications
- 4,862
- Assignees
- 918
- Inventors
- 6,810
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 7 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 12 | 0 |
| 1995 | 6 | 0 |
| 1996 | 18 | 0 |
| 1997 | 17 | 0 |
| 1998 | 33 | 0 |
| 1999 | 16 | 0 |
| 2000 | 35 | 0 |
| 2001 | 24 | 10 |
| 2002 | 22 | 54 |
| 2003 | 41 | 49 |
| 2004 | 41 | 61 |
| 2005 | 39 | 59 |
| 2006 | 37 | 63 |
| 2007 | 43 | 79 |
| 2008 | 43 | 101 |
| 2009 | 37 | 109 |
| 2010 | 64 | 117 |
| 2011 | 60 | 74 |
| 2012 | 76 | 103 |
| 2013 | 95 | 125 |
| 2014 | 80 | 180 |
| 2015 | 149 | 171 |
| 2016 | 159 | 218 |
| 2017 | 161 | 213 |
| 2018 | 186 | 205 |
| 2019 | 207 | 244 |
| 2020 | 191 | 297 |
| 2021 | 232 | 344 |
| 2022 | 238 | 374 |
| 2023 | 199 | 461 |
| 2024 | 308 | 490 |
| 2025 | 304 | 379 |
| 2026 | 200 | 282 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor module6 Oct 2026US 12,757,754 B2Denso Corporation
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Semiconductor module and power converter22 Sep 2026US 12,745,633 B2Mitsubishi Electric Corporation
- Power semiconductor module and manufacturing method thereof22 Sep 2026US 12,745,637 B2Huawei Digital Power Technologies Co., Ltd.
- Semiconductor device, power conversion device and moving body22 Sep 2026US 12,745,640 B2Mitsubishi Electric Corporation
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Semiconductor package8 Oct 2026US 2026/0314409 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Power electronics module and inverter including a power electronics module8 Oct 2026US 2026/0314465 A1Schaeffler Technologies AG & Co. KG
Most cited
By later US patents
- Layer transfer process and functionally enhanced integrated circuits produced thereby298US 7,855,101 B2International Business Machines Corporation · 2010
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Semiconductor device with plate heat sink free from cracks due to thermal stress and process for assembling it with package154US 6,133,071 ANEC Corporation · 2000
- Cooling apparatus for semiconductor chips149US 8,081,465 B2Fuji Electric Systems Co., Ltd. · 2011