Semiconductor module and power converter

A semiconductor module comprising:

• a semiconductor chip;
• an insulating substrate including a main circuit pattern electrically connected to the semiconductor chip and an insulating layer sandwiching the main circuit pattern together with the semiconductor chip;
• a relay board to sandwich the semiconductor chip together with the main circuit pattern in a sandwiching direction in which the insulating layer and the semiconductor chip sandwich the main circuit pattern, the relay board being electrically connected to the main circuit pattern through the semiconductor chip;
• a heat-dissipating component sandwiched between the insulating substrate and the relay board in the sandwiching direction;
• and
• a conductive post sandwiched between the main circuit pattern and the relay board in the sandwiching direction, the conductive post being electrically connected to the main circuit pattern and the relay board, wherein
• the heat-dissipating component is electrically insulated from the main circuit pattern, and
• the main circuit pattern at least partially surrounds the heat-dissipating component on the insulating layer.