H10W 40/257
Having a heterogeneous or anisotropic structure
Official title: {having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence)}
H10W40/257 (Having a heterogeneous or anisotropic structure) appears on 771 US grants and 961 published applications in this corpus.
Search patents in H10W- Granted patents
- 771
- Published applications
- 961
- Assignees
- 436
- Inventors
- 2,164
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 10 | 0 |
| 1993 | 11 | 0 |
| 1994 | 11 | 0 |
| 1995 | 9 | 0 |
| 1996 | 15 | 0 |
| 1997 | 17 | 0 |
| 1998 | 25 | 0 |
| 1999 | 22 | 0 |
| 2000 | 23 | 0 |
| 2001 | 18 | 8 |
| 2002 | 23 | 21 |
| 2003 | 15 | 28 |
| 2004 | 24 | 33 |
| 2005 | 21 | 26 |
| 2006 | 16 | 31 |
| 2007 | 22 | 47 |
| 2008 | 18 | 21 |
| 2009 | 13 | 23 |
| 2010 | 14 | 20 |
| 2011 | 14 | 16 |
| 2012 | 15 | 26 |
| 2013 | 18 | 17 |
| 2014 | 19 | 29 |
| 2015 | 18 | 26 |
| 2016 | 17 | 30 |
| 2017 | 22 | 29 |
| 2018 | 17 | 38 |
| 2019 | 33 | 33 |
| 2020 | 30 | 57 |
| 2021 | 35 | 64 |
| 2022 | 32 | 50 |
| 2023 | 37 | 53 |
| 2024 | 41 | 60 |
| 2025 | 41 | 46 |
| 2026 | 27 | 129 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Thermally-conductive sheet, method for installing same, and method for manufacturing same25 Aug 2026US 12,716,012 B2Sekisui Polymatech Co., Ltd.
- Controlling an iron slurry in semiconductor assembly25 Aug 2026US 12,721,166 B2Lenovo (Singapore) Pte. Ltd.
- Electronic package module25 Aug 2026US 12,721,169 B2Acer Incorporated
- Thermally conductive resin sheet11 Aug 2026US 12,703,819 B2Sekisui Chemical Co., Ltd.
- Bonding layer between stacked integrated circuits4 Aug 2026US 12,701,773 B2Honeywell International Inc.
- Unit8 Oct 2026US 2026/0314411 A1JATCO Ltd
- Aluminum-diamond composite, method for producing aluminum-diamond composite, and semiconductor package1 Oct 2026US 2026/0305340 A1Denka Company Limited
- Controlling an iron slurry in semiconductor assembly1 Oct 2026US 2026/0305343 A1Lenovo (Singapore) Pte. Ltd.
- Diamond-based thermal cooling devices methods and materials24 Sep 2026US 2026/0293675 A1
- Semiconductor device and semiconductor memory device24 Sep 2026US 2026/0293761 A1
Most cited
By later US patents
- Thermal transfer coating486US 7,695,808 B23M Innovative Properties Company · 2010
- Mold compound291US 5,709,960 AMotorola, Inc. · 1998
- Cooling device with heat pipe167US 6,082,443 AFurukawa Electric Co., Ltd. · 2000
- Integrated circuit package136US 4,437,235 AHoneywell Information Systems Inc. · 1984
- Thermally conductive interface materials and methods of using the same133US 5,213,868 AChomerics, Inc. · 1993