Thermally conductive interface materials and methods of using the same
AssigneeChomerics, Inc.
InventorsJames Liberty, Peter Jones
Life of this patent
Estimating the term…
Abstract
A thermally conductive interface material formed of a polymeric binder and one or more thermally fillers is disclosed. One or both of the major surfaces of the interface material has a means for removing air from between that surface and the surface to which it is attached, such as a heat sinker an electronic component. Alternatively, the heat sink or component may have the air removal means instead of or in addition to the interface material. The air removal means may be a series of embossments, channels or grooves or throughholes. Preferably, the interface is a pressure sensitive acrylic adhesive material and more preferably, it is in the form of a tape.
Claims6
A thermally conductive interface comprising a first layer of thermally conductive pressure sensitive adhesive, a support layer overlaying the first layer, a second layer of thermally conductive pressure sensitive adhesive overlaying the support layer and an air removal device selected from the group consisting of embossments, channels, grooves, and throughholes, the air removal device being formed on at least an exposed surface of the first layer.
A thermally conductive tape comprising a first layer of thermally conductive, electrically insulative pressure sensitive adhesive, a support layer overlaying the adhesive layer and a second layer of thermally conductive, electrically insulating pressure sensitive adhesive, the second layer being on top of and bonded to the support layer and wherein at least one of the layers has an air removal device selected from the group consisting of embossments, channels, and grooves, formed in its exposed surface.
Dependencies are inferred from the claim text.