Bonding layer between stacked integrated circuits
AssigneeHoneywell International Inc.
InventorsJames L. Tucker, Eric E. Vogt, James W Karcz, Jr.
Life of this patent
Estimating the term…
Abstract
A semiconductor assembly including: a first semiconductor having a plurality of electrical contacts extending from an upper surface of the first semiconductor; a second semiconductor adjacent to the first semiconductor; and a mesh disposed between and affixed to the upper surface of the first semiconductor and the lower surface of the second semiconductor. A lower surface of the second semiconductor is electrically connected to the first semiconductor via the plurality of electrical contacts. The mesh comprises a plurality of interconnecting struts defining a plurality of openings, wherein the plurality of openings is configured to receive the plurality of electrical contacts.
Claims20
A stacked semiconductor assembly comprising:
- a first semiconductor having a plurality of electrical contacts extending from an upper surface of the first semiconductor;
- a second semiconductor adjacent to the first semiconductor, wherein a lower surface of the second semiconductor is electrically connected to the first semiconductor via the plurality of electrical contacts;
- and
- a mesh disposed between and affixed to the upper surface of the first semiconductor and the lower surface of the second semiconductor, wherein the mesh comprises a plurality of interconnecting struts defining a plurality of openings, and wherein the plurality of openings is configured to receive the plurality of electrical contacts,
- wherein the mesh is configured to affix the first semiconductor to the second semiconductor.
A semiconductor mesh interface comprising:
- an adhesive material comprising a plurality of interconnecting struts defining a plurality of openings extending from a first surface of the adhesive material to a second surface of the adhesive material,
- wherein the first surface of the adhesive material is configured to be affixed to an upper surface of a first semiconductor,
- wherein the second surface of the adhesive material is configured to be affixed to a lower surface of a second semiconductor,
- wherein one or more of the plurality of openings is configured to receive electrical contacts extending between the first semiconductor and the second semiconductor, and
- wherein the adhesive material is configured to affix the first semiconductor to the second semiconductor.
A method comprising:
- disposing a mesh over a first surface of a first semiconductor, wherein the mesh comprises:
- an adhesive material comprising a plurality of interconnecting struts defining a plurality of openings,
- wherein when the mesh is disposed over the first surface of the first semiconductor, the plurality of openings is configured to receive a first plurality of electrical contacts extending from the first surface of the first semiconductor;
- aligning a second plurality of electrical contacts extending from a second surface of a second semiconductor with the first plurality of electrical contacts of the first semiconductor;
- electrically connecting the first semiconductor with the second semiconductor via the first plurality of electrical contacts and the second plurality of electrical contacts;
- and
- affixing a first surface of the mesh to the first surface of the first semiconductor and a second surface of the mesh to the second surface of the second semiconductor.
Dependencies are inferred from the claim text.