Cooling device with heat pipe
AssigneeFurukawa Electric Co., Ltd.
InventorsMasaaki Yamamoto, Jun Niekawa, Tatuhiko Ueki, Masami Ikeda, Ken Sasaki
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AssigneeFurukawa Electric Co., Ltd.
InventorsMasaaki Yamamoto, Jun Niekawa, Tatuhiko Ueki, Masami Ikeda, Ken Sasaki
Estimating the term…
The invention provides a cooling device with a heat pipe, which is capable of effectively radiating heat from electronic equipment such as a small-sized computer. The cooling device with the heat pipe comprises a plate-like container made of heat transferring metal for containing a working fluid, and having a heat absorbing surface larger than that of the body to be cooled, a heat transferring metal column, and a hollow portion in which the working fluid exists. An alternating embodiment of the cooling device with the heat pipe comprises a plate-like container made of heat transferring metal, a heat absorbing wall having a large heat absorbing surface, and a plurality of protrusion portions.
A cooling device with a heat pipe comprising:
A cooling device provided with a heat pipe, wherein
Dependencies are inferred from the claim text.