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US 2026/0293761 A1Published application
Semiconductor device and semiconductor memory device
OwnerHideo AOKI, Kazuma HASEGAWA +1inventors
InventorsHideo AOKI, Kazuma HASEGAWA, Tsukasa KONNO
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Abstract
A semiconductor device includes a plurality of first semiconductor chips stacked in a vertical direction; a first chip-mounted member provided between a lower one and an upper one of the first semiconductor chips; and a plurality of second semiconductor chips each provided on an upper surface of a corresponding lower one of the plurality of first semiconductor chips. The first chip-mounted member has a thermal conductive member having a thermal conductivity higher than a thermal conductivity of the second semiconductor chip.
Claims18
A semiconductor device comprising:
- a plurality of first semiconductor chips stacked in a vertical direction;
- a first chip-mounted member provided between a lower one and an upper one of the first semiconductor chips;
- and
- a plurality of second semiconductor chips each provided on an upper surface of a corresponding lower one of the plurality of first semiconductor chips, wherein
- the first chip-mounted member has a thermal conductive member having a thermal conductivity higher than a thermal conductivity of the second semiconductor chip.
2 more elements
Dependencies are inferred from the claim text.