Thermally-conductive sheet, method for installing same, and method for manufacturing same
AssigneeSekisui Polymatech Co., Ltd.
InventorsKenta Kuroo, Hiromichi Iwazaki, Hiroki Kudoh
Life of this patent
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Abstract
Provided is a heat-conductive sheet including: a binder component that is a mixture of a silicone matrix (A) and an alkyl silicone compound (B); and a heat-conductive filler (C) dispersed in the binder component, a content of the alkyl silicone compound (B) being 2.0 to 20 parts by mass with respect to 100 parts by mass of a total of the silicone matrix (A) and the alkyl silicone compound (B), and the heat-conductive sheet having an expansion coefficient X of −2.0% or more and less than 0%, as measured by a thermomechanical analyzer (TMA) in the conditions of a compressive load of 0.01 N, a measurement temperature of 30 to 80° C., and a heating rate of 2° C./minute.
Claims9
A heat-conductive sheet comprising:
- a binder component that is a mixture of a silicone matrix (A) and an alkyl silicone compound (B);
- and
- a heat-conductive filler (C) dispersed in the binder component,
- a content of the alkyl silicone compound (B) being 2.0 to 20 parts by mass with respect to 100 parts by mass of a total of the silicone matrix (A) and the alkyl silicone compound (B), and
- the heat-conductive sheet having an expansion coefficient X of −2.0% or more and less than 0%, as measured by a thermomechanical analyzer (TMA) in the conditions of a compressive load of 0.01 N, a measurement temperature of 30 to 80° C., and a heating rate of 2° C./minute.
A method for mounting a heat-conductive sheet, the method comprising:
- disposing a heat-conductive sheet on a surface of a first member, the heat-conductive sheet comprising:
- a binder component being a mixture of a silicone matrix (A) and an alkyl silicone compound (B);
- and a heat-conductive filler (C) dispersed in the binder component;
- a content of the alkyl silicone compound (B) being 2.0 to 20 parts by mass with respect to 100 parts by mass of a total of the silicone matrix (A) and the alkyl silicone compound (B), and the heat-conductive sheet having an expansion coefficient X of −2.0% or more and less than 0%, as measured by a thermomechanical analyzer (TMA) in the conditions of a compressive load of 0.01 N, a measurement temperature of 30 to 80° C., and a heating rate of 2° C./minute;
- heating the heat-conductive sheet;
- and
- disposing a second member on a surface of the heat-conductive sheet, the surface being opposite from the first member side, and pressurizing the heat-conductive sheet, to install the heat-conductive sheet between the first and second members.
Dependencies are inferred from the claim text.