US 2026/0314406 A1 · A THERMAL INTERFACE MATERIAL, AN INTEGRATED CIRCUIT FORMED THEREWITH, AND A METHOD OF APPLICATION THEREOF

Abstract

A thermal interface material, an integrated circuit formed therewith, and a method of application thereof are provided. The thermal interface material includes 5% to 30% by volume of a polymer component and at least 70% by volume of liquid metal droplets, all based on total volume of the thermal interface material. The polymer component has a first polymer having a molecular weight in a range of 400 g/mol to 400,000 g/mol. The liquid metal droplets are dispersed throughout the polymer component.

Claims44

Dependent claims

A thermal interface material comprising:

5% to 30% by volume of a polymer component based on a total volume of the thermal interface material, the polymer component comprising polyalkylene glycol having a molecular weight in a range of 400 g/mol to 4,000 g/mol;
and
at least 70% by volume of liquid metal droplets based on total volume of the thermal interface material, wherein the liquid metal droplets are dispersed throughout the polymer component.

Dependencies are inferred from the claim text.

A thermal interface material, an integrated circuit formed therewith, and a method of application thereof

Life of this patent

A thermal interface material, an integrated circuit formed therewith, and a method of application thereof

Life of this patent

Abstract

Claims44