H10W 40/251
Organics
Official title: {Organics}
H10W40/251 (Organics) appears on 1,456 US grants and 2,080 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,456
- Published applications
- 2,080
- Assignees
- 580
- Inventors
- 3,979
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 8 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 12 | 0 |
| 1995 | 8 | 0 |
| 1996 | 10 | 0 |
| 1997 | 17 | 0 |
| 1998 | 17 | 0 |
| 1999 | 17 | 0 |
| 2000 | 26 | 0 |
| 2001 | 18 | 11 |
| 2002 | 26 | 37 |
| 2003 | 35 | 58 |
| 2004 | 36 | 41 |
| 2005 | 31 | 38 |
| 2006 | 25 | 44 |
| 2007 | 18 | 54 |
| 2008 | 19 | 40 |
| 2009 | 20 | 35 |
| 2010 | 25 | 42 |
| 2011 | 24 | 40 |
| 2012 | 20 | 32 |
| 2013 | 25 | 49 |
| 2014 | 31 | 68 |
| 2015 | 36 | 93 |
| 2016 | 53 | 115 |
| 2017 | 74 | 108 |
| 2018 | 97 | 105 |
| 2019 | 107 | 150 |
| 2020 | 98 | 141 |
| 2021 | 96 | 141 |
| 2022 | 80 | 158 |
| 2023 | 94 | 126 |
| 2024 | 90 | 142 |
| 2025 | 77 | 107 |
| 2026 | 54 | 105 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Thermally-conductive sheet, method for installing same, and method for manufacturing same25 Aug 2026US 12,716,012 B2Sekisui Polymatech Co., Ltd.
- Structural thermal interfacing for lidded semiconductor packages25 Aug 2026US 12,721,159 B2Advanced Micro Devices, Inc.
- Display device and method for manufacturing the same25 Aug 2026US 12,721,172 B2Samsung Display Co., Ltd.
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Thermally conductive silicone composition and production method therefor1 Oct 2026US 2026/0297411 A1Shin-Etsu Chemical Co., Ltd.
- Semiconductor device1 Oct 2026US 2026/0305334 A1Fuji Electric Co., Ltd.
- Heat-conducting sheet, heat-dissipating device, heat-conducting sheet production method, and adhesive layer-formation composition24 Sep 2026US 2026/0293671 A1Resonac Corporation
Most cited
By later US patents
- Apparatus for absorbing and dissipating excess heat generated by a system553US 7,593,230 B2Sensys Medical, Inc. · 2009
- Electronic package with improved thermal properties247US 5,650,663 AOlin Corporation · 1997
- Encapsulated dies with enhanced thermal performance201US 9,613,831 B2Qorvo US, Inc. · 2017
- Heat sink and thermal interface having shielding to attenuate electromagnetic interference192US 6,483,707 B1Loctite Corporation · 2002
- Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer190US 9,530,709 B2Qorvo US, Inc. · 2016