Package structure and method for fabricating the same

A package structure, comprising:

• a substrate having a first board surface;
• a semiconductor package and a plurality of pins, the semiconductor package having an upper surface and a lower surface, the pins being disposed on the lower surface, wherein the pins are sandwiched between the first board surface of the substrate and the lower surface of the semiconductor package, the semiconductor package is electrically connected to the substrate through the plurality of pins, the semiconductor package has a first vertical projection projected onto the first board surface, and at least one adhesive groove is disposed on the first board surface and is located in at least one portion of the first vertical projection and a periphery of the first vertical projection;
• at least one adhesive body disposed in the at least one adhesive groove, wherein the at least one adhesive body protrudes upward from the at least one adhesive groove to contact the lower surface of the semiconductor package, so as to fix the semiconductor package on the first board surface;
• wherein the at least one adhesive groove does not overlap with the plurality of pins, and the at least one adhesive body does not contact the plurality of pins;
• wherein the package structure has no underfill, and the plurality of pins do not contact any colloid.