Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorShinji TADA
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor device that can suppress warpage of a semiconductor module. The semiconductor device includes a semiconductor module including a heat dissipation plate, an electrically-conductive plate bonded to a top surface of the heat dissipation plate by a first resin sheet, and a semiconductor chip bonded to a top surface of the electrically-conductive plate by a bonding material. A cooler is bonded to a bottom surface of the semiconductor module by a second resin sheet. A resin sheet having higher electrical insulation than the second resin sheet is used as the first resin sheet. A resin sheet having higher thermal conductivity than the first resin sheet is used as the second resin sheet.
Claims7
A semiconductor device comprising:
- a semiconductor module including a heat dissipation plate, an electrically-conductive plate bonded to a top surface of the heat dissipation plate by a first resin sheet, and a semiconductor chip bonded to a top surface of the electrically-conductive plate by a bonding material;
- and
- a cooler bonded to a bottom surface of the semiconductor module by a second resin sheet, wherein:
- the first resin sheet has higher electrical insulation than the second resin sheet;
- and
- the second resin sheet has higher thermal conductivity than the first resin sheet.
Dependencies are inferred from the claim text.