Structural thermal interfacing for lidded semiconductor packages
AssigneeAdvanced Micro Devices, Inc.
InventorsPriyal Shah, Raja Swaminathan, Brett P. Wilkerson
Life of this patent
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Abstract
Structural thermal interfacing for lidded semiconductor packages, including: applying, to a periphery of a surface of a chip, a stiffening adhesive framing a center portion of the chip; applying, to the center portion of the chip, a thermal interface material; and applying a lid to the chip, wherein the lid contacts the stiffening adhesive and is thermally coupled to the chip via the thermal interface material after application to the chip.
Claims16
A semiconductor package for structural thermal interfacing for lidded semiconductor packages, comprising:
- a substrate;
- a chip bonded to the substrate;
- and
- a lid, wherein the lid is bonded to the chip by a stiffening adhesive contacting a top surface of the chip and in a pattern that frames a center portion of the chip, and wherein the lid is thermally coupled to the chip by a thermal interface material.
An apparatus for structural thermal interfacing for lidded semiconductor packages, comprising:
- computer memory;
- a chip operatively coupled to the computer memory;
- and
- a lid, wherein the lid is bonded to the chip by a stiffening adhesive contacting a top surface of the chip and in a pattern that frames a center portion of the chip, and wherein the lid is thermally coupled to the chip by a thermal interface material.
Dependencies are inferred from the claim text.