H10W 40/231
Characterised by their places of attachment or cooling paths
Official title: {characterised by their places of attachment or cooling paths}
H10W40/231 (Characterised by their places of attachment or cooling paths) appears on 941 US grants and 1,169 published applications in this corpus.
Search patents in H10W- Granted patents
- 941
- Published applications
- 1,169
- Assignees
- 486
- Inventors
- 2,665
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 8 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 5 | 0 |
| 1985 | 6 | 0 |
| 1986 | 13 | 0 |
| 1987 | 16 | 0 |
| 1988 | 8 | 0 |
| 1989 | 11 | 0 |
| 1990 | 6 | 0 |
| 1991 | 13 | 0 |
| 1992 | 12 | 0 |
| 1993 | 14 | 0 |
| 1994 | 14 | 0 |
| 1995 | 13 | 0 |
| 1996 | 10 | 0 |
| 1997 | 15 | 0 |
| 1998 | 21 | 0 |
| 1999 | 16 | 0 |
| 2000 | 14 | 0 |
| 2001 | 8 | 3 |
| 2002 | 20 | 10 |
| 2003 | 11 | 4 |
| 2004 | 10 | 14 |
| 2005 | 6 | 15 |
| 2006 | 13 | 34 |
| 2007 | 18 | 35 |
| 2008 | 34 | 56 |
| 2009 | 41 | 41 |
| 2010 | 37 | 39 |
| 2011 | 23 | 15 |
| 2012 | 14 | 9 |
| 2013 | 9 | 17 |
| 2014 | 11 | 32 |
| 2015 | 19 | 29 |
| 2016 | 26 | 37 |
| 2017 | 21 | 28 |
| 2018 | 38 | 46 |
| 2019 | 37 | 53 |
| 2020 | 50 | 55 |
| 2021 | 48 | 49 |
| 2022 | 35 | 40 |
| 2023 | 34 | 66 |
| 2024 | 40 | 93 |
| 2025 | 61 | 50 |
| 2026 | 33 | 299 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Electronic package module25 Aug 2026US 12,721,169 B2Acer Incorporated
- Display device and method for manufacturing the same25 Aug 2026US 12,721,172 B2Samsung Display Co., Ltd.
- Thermally conductive sheet, heat dissipation device, and method for producing thermally conductive sheet8 Oct 2026US 2026/0314400 A1Resonac Corporation
- Electronic device including insulation plate cover and grounding piece8 Oct 2026US 2026/0314401 A1LG Innotek Co., Ltd.
- Electronic component and apparatus8 Oct 2026US 2026/0314402 A1
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Semiconductor package8 Oct 2026US 2026/0314404 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Cooling cover for RF power devices341US 5,428,504 AMotorola, Inc. · 1995
- Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer201US 5,673,479 ALSI Logic Corporation · 1997
- CPU cooling system192US 6,166,907 A2000
- Method of packaging and powering integrated circuit chips and the chip assembly formed thereby175US 4,954,878 ADigital Equipment Corporation · 1990
- Land grid array package/circuit board assemblies and methods for constructing the same133US 5,473,510 AConvex Computer Corporation · 1995