H10W 40/233
Attached to chips
Official title: {attached to chips}
H10W40/233 (Attached to chips) appears on 133 US grants and 177 published applications in this corpus.
Search patents in H10W- Granted patents
- 133
- Published applications
- 177
- Assignees
- 136
- Inventors
- 607
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 2 | 2 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 3 |
| 2008 | 4 | 1 |
| 2009 | 1 | 4 |
| 2010 | 2 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 2 |
| 2013 | 0 | 2 |
| 2014 | 1 | 2 |
| 2015 | 2 | 4 |
| 2016 | 3 | 5 |
| 2017 | 2 | 2 |
| 2018 | 5 | 4 |
| 2019 | 5 | 7 |
| 2020 | 5 | 6 |
| 2021 | 5 | 7 |
| 2022 | 6 | 7 |
| 2023 | 3 | 14 |
| 2024 | 8 | 9 |
| 2025 | 10 | 12 |
| 2026 | 3 | 80 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device and method for manufacturing the same25 Aug 2026US 12,721,172 B2Samsung Display Co., Ltd.
- Resin-sealed semiconductor device18 Aug 2026US 12,713,916 B2Mitsubishi Electric Corporation
- Two-sided liquid cooling5 May 2026US 12,622,272 B1Adeia Semiconductor Bonding Technologies Inc.
- Integrated cooling assembly with upper and lower channels30 Dec 2025US 12,513,855 B1Adeia Semiconductor Bonding Technologies Inc.
- Chip module and electronic device16 Dec 2025US 12,500,136 B2Huawei Technologies Co., Ltd.
- Thermally conductive sheet, heat dissipation device, and method for producing thermally conductive sheet8 Oct 2026US 2026/0314400 A1Resonac Corporation
- Power semiconductor module and method of manufacturing the same1 Oct 2026US 2026/0305335 A1Infineon Technologies AG
- Structures and processes for attaching cold plates to multi chip modules1 Oct 2026US 2026/0305336 A1
- Semiconductor device and method of manufacturing the same1 Oct 2026US 2026/0305376 A1Renesas Electronics Corporation
- Stacked power modules and method of manufacturing17 Sep 2026US 2026/0282504 A1General Electric Company
Most cited
By later US patents
- Cooling cover for RF power devices341US 5,428,504 AMotorola, Inc. · 1995
- Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer201US 5,673,479 ALSI Logic Corporation · 1997
- Method of packaging and powering integrated circuit chips and the chip assembly formed thereby175US 4,954,878 ADigital Equipment Corporation · 1990
- Dimensionally stable semiconductor device102US 4,561,011 AMitsubishi Denki Kabushiki Kaisha · 1985
- Integrated multi-chip module having a conformal chip/heat exchanger interface98US 5,323,292 AHewlett-Packard Company · 1994