Chip module and electronic device
AssigneeHuawei Technologies Co., Ltd.
InventorsFeng Wang, Youhu Zhao, Yalei Zhang, Yangyun Xie
Life of this patent
Estimating the term…
Abstract
A chip module includes a circuit board, a slot disposed on a surface of one side of the circuit board, a lidless packaged chip, a heat radiator, and a substrate fixing assembly. The lidless packaged chip includes a substrate and a die packaged on the substrate. The slot is electrically connected to the circuit board, the lidless packaged chip has a connecting part on one side of the substrate facing away from the die, and the connecting part is inserted into the slot. The heat radiator is press-fitted on one side of the die facing away from the circuit board. The substrate fixing assembly is press-fitted at a periphery of one side of the substrate facing away from the circuit board and avoids the die.
Claims18
A chip module, comprising a circuit board, a slot disposed on a surface of the circuit board, a lidless packaged chip, a heat radiator, and a substrate fixing assembly, wherein
- the lidless packaged chip comprises a substrate and a die packaged on the substrate, a connecting part of the lidless packaged chip is connected to an elastic terminal in the slot, the heat radiator is press-fitted on one side of the die, and the substrate fixing assembly is pressed at a periphery of one side of the substrate away from the circuit board and avoids contact with the die, wherein the one side of the die faces away from the circuit board, wherein the substrate fixing assembly is an upper cover, the upper cover has a hollow structure that avoids contact with the die, the heat radiator has a protrusion in a direction toward the circuit board, and wherein either the protrusion passes through the hollow structure and makes contact with the die, or a contact area between the protrusion and the die is located in the hollow structure.
An electronic device, comprising a chip module which comprises a circuit board, a slot disposed on a surface of the circuit board, a lidless packaged chip, a heat radiator, and a substrate fixing assembly, wherein
- the lidless packaged chip comprises a substrate and a die packaged on the substrate, a connecting part of the lidless packaged chip is connected to an elastic terminal in the slot, the heat radiator is press-fitted on one side of the die, and the substrate fixing assembly is pressed at a periphery of one side of the substrate away from the circuit board and avoids contact with the die, wherein the one side of the die faces away from the circuit board, wherein the substrate fixing assembly is an upper cover, and the upper cover has a hollow structure that avoids contact with the die, the heat radiator has a protrusion in a direction toward the circuit board, and wherein either the protrusion passes through the hollow structure and makes contact with the die, or a contact area between the protrusion and the die is located in the hollow structure.
Dependencies are inferred from the claim text.